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| Datasheet File OCR Text: |
| geometry principal device type czsh6-100c gross die per 5 inch wafer 5,516 process CPD107 schottky rectifier 3 amp schottky rectifier chip process details die size 56 x 56 mils die thickness 11.8 mils anode bonding pad area 51 x 51 mils top side metalization al - 30,000? back side metalization ag - 20,000? www.centralsemi.com r0 (1-march 2011)
process CPD107 typical electrical characteristics www.centralsemi.com r0 (1-march 2011) |
Price & Availability of CPD107
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